1. 提供技术服务,保证户使用没问题
2. 支持市场所有的常规PLC
3. 支持常规组态软件,如wincc、组态王、组态屏等
4. 支持各类传感器,私有协议、modbus、web等
5. 无需二次开发,只需配置映射到已有的PLC地址
GEM300协议是为了满足300MM半导体生产需求而定义的特殊标准。
在说明GEM300协议之前,我们先要了解300MM半导体生产的特点:
首先,从生产效率的角度来看,300mm晶圆的直径比传统200mm晶圆大,这意味着每个晶圆可以制造出更多的芯片。例如,以中芯国际某芯片为例,300mm晶圆可以制造出大约232个这样的芯片,而200mm晶圆仅能制造出大约88个芯片。因此,尽管大尺寸晶圆的制造难度更大,但它们在产出数量上的优势使得它们更适合大规模生产。
其次,从应用领域的角度来看,300mm晶圆通常用于生产高端芯片,如CPU、GPU等,而200mm晶圆则更多用于电源管理芯片等对技术要求不那么高的领域。这是因为大尺寸晶圆能够提供更大的芯片面积,这对于集成度高的复杂电路来说是必要的。此外,300mm晶圆主要应用于智能手机、计算机等领域,而200mm晶圆则更多应用于移动通信、汽车电子等领域。
最后,从技术难度的角度来看,制造300mm晶圆的难度要大于200mm晶圆。这不仅仅是因为尺寸的增大,还包括了对设备精度和材料质量的更高要求。
GEM300協定是為了滿足300MM電晶體生產需求而定義的特殊標準。
在說明GEM300協定之前,我們先要瞭解300MM電晶體生產的特點:
首先,從生產效率的角度來看,300mm晶圓的直徑比傳統200mm晶圓大,這意味著每個晶圓可以製造出更多的晶片。 例如,以中芯國際某晶片為例,300mm晶圓可以製造出大約232個這樣的晶片,而200mm晶圓僅能製造出大約88個晶片。 囙此,儘管大尺寸晶圓的製造難度更大,但它們在產出數量上的優勢使得它們更適合大規模生產。
其次,從應用領域的角度來看,300mm晶圓通常用於生產高端晶片,如CPU、GPU等,而200mm晶圓則更多用於電源管理晶片等對科技要求不那麼高的領域。 這是因為大尺寸晶圓能够提供更大的晶片面積,這對於集成度高的複雜電路來說是必要的。 此外,300mm晶圓主要應用於智能手機、電腦等領域,而200mm晶圓則更多應用於移動通信、汽車電子等領域。
最後,從科技難度的角度來看,製造300mm晶圓的難度要大於200mm晶圓。 這不僅僅是因為尺寸的增大,還包括了對設備精度和資料質量的更高要求。
The GEM300 protocol is a special standard defined to meet the production needs of 300MM semiconductors.
Before explaining the GEM300 protocol, we need to understand the characteristics of 300MM semiconductor production:
Firstly, from the perspective of production efficiency, the diameter of 300mm wafers is larger than that of traditional 200mm wafers, which means that each wafer can produce more chips. For example, taking a certain chip from SMIC as an example, a 300mm wafer can produce approximately 232 such chips, while a 200mm wafer can only produce approximately 88 chips. Therefore, although the manufacturing difficulty of large-sized wafers is greater, their advantage in output quantity makes them more suitable for large-scale production.
Secondly, from the perspective of application fields, 300mm wafers are usually used to produce high-end chips such as CPUs, GPUs, etc., while 200mm wafers are more commonly used in areas such as power management chips that do not require high technical requirements. This is because large-sized wafers can provide a larger chip area, which is necessary for complex circuits with high integration. In addition, 300mm wafers are mainly used in fields such as smartphones and computers, while 200mm wafers are more commonly used in fields such as mobile communication and automotive electronics.
Finally, from the perspective of technical difficulty, the difficulty of manufacturing 300mm wafers is greater than that of 200mm wafers. This is not only due to the increase in size, but also includes higher requirements for equipment accuracy and material quality.